It is reported that the PACK EXPO International 2026 fair will be held in Chicago, Illinois, between October 18-21, 2026. Pack Expo International is a fair showcasing the latest innovations in packaging, processing, automation, and packaging technologies, and it is expected that approximately 45,000 industry professionals, as well as leading companies in the sector, will attend. To benefit from free fair entry and delegation advantages, the registration of accepted delegates will be done through the official delegation registration system of the US Department of Commerce. The text further states that participants will cover their own airfare, accommodation, city transportation, and personal expenses, and the delegation service fee is $100 USD per person. Participants whose delegation registration is completed will be provided with an invitation letter, and depending on the capacity of the Eligibility and Consular Department, support can be provided regarding group visa appointment requests. This support does not guarantee a visa appointment or visa issuance. Firms wishing to participate in the aforementioned committee and benefit from the specified services can contact Naz Demirdöven (naz.demirdoven@trade.gov) and Ayşesu Celasun (aysesu.celasun@trade.gov) by September 4, 2026.